Copper plating additive

Copper plating additive

The experiments show that the Hopax electroplating additive still exhibits excellent conductivity and stability in the environment of high acidity and high current, and can effectively absorb metal ions and improve the deposition rate.


Hopax electroplating additive is used by world-famous electroplating solution manufacturers as a brightener for copper electroplating, nickel electroplating and precious metal electroplating processes.

Sodium 3-mercaptopropane sulfonate (MPS)

Sodium 3-mercaptopropane sulfonate (MPS)

3-Mercapto-1-propane sulfonic acid sodium salt
CAS No:17636-10-1
Molecular formula :C3H7O3S2Na
Molecular weight :178.2
Sodium N, n-dimethyl dithiocarbonyl propane sulfonate (DPS)

Sodium N, n-dimethyl dithiocarbonyl propane sulfonate (DPS)

N, n-dimethyl -dithiocarbamyl propyl sulfonic acid sodium salt
CAS No:18880-36-9
Molecular formula :C6H12NNaO3S3
Molecular weight :265.4
Sodium polydithiopropane sulfonate (SPS-95)

Sodium polydithiopropane sulfonate (SPS-95)

3,3'-Dithiobis-1-propanesulfonic acid, disodium salt
CAS No:27206-35-5
Molecular formula :C6H12O6S4Na2
Molecular weight :354.4
Sodium polydithiopropane sulfonate (SPS-99)

Sodium polydithiopropane sulfonate (SPS-99)

3,3'-Dithiobis-1-propanesulfonic acid, disodium salt
CAS No:27206-35-5
Molecular formula :C6H12O6S4Na2
Molecular weight :354.4
Isothiourea propionic acid internal salt (UPS)

Isothiourea propionic acid internal salt (UPS)

3-S-Isothiuronium propylsulfonate
CAS No:21668-81-5
Molecular formula :C4H10N2O3S2
Molecular weight :198.2